Arizona State University (ASU) and Deca Technologies (Deca) announced a groundbreaking collaboration to create North America’s first fan-out wafer-level packaging (FOWLP) research and development center. The center will combine state-of-the-art advanced-packaging technology, equipment, processes, materials, expertise and training, fostering the development of new capabilities from proof of concept to pilot scale. ASU is the first university implementation of Deca’s M-SeriesTM fan- out and Adaptive