China-based Wuhan Xinxin Semiconductor Manufacturing is kicking off a project focused on developing and manufacturing high-bandwidth memory (HBM) XMC is controlled by Yangtze Memory Technology Co. (YMTC), China's leading producer of 3D NAND. The project plans to employ 3D chip stacking technology and acquire 16 sets of equipment to reach a monthly production target of 3,000 wafers.